Cell Segment Product Series

Iintlobo zeemveliso

Cell Segment Product Series

iveliso ezifakiwe

Eyokuqala yehlabathi: Umatshini wokusasaza weNanomaterial onesiphumo semathodi yoqhushumbo

Ibhetri eshushu cofa (cofa okubandayo, cofa shushu)

I-Slitter (isantya esiphezulu, isantya esiphantsi)

Steel Rule Die Cutting Machine

Umatshini wokusika oguquguqukayo (ityala lokuqala laseTshayina)

I-Winder yesantya esiphezulu (ibhetri yePrismatic kunye neCylindrical)

Izitishi eziphindwe kabini Umatshini wokupakisha we-Auto onesantya esiphezulu

Umatshini wokusika kunye ne-laminating

Umatshini wokusika weLaser kunye nokusika

I-Laser Die-ukusika kunye ne-Winding Lug Push Umatshini wokuTlatyiswa

0102030405

Umatshini wokusika weLaser kunye nokusika

Esi sixhobo sisetyenziswa ikakhulu amandla lithium ibhetri electrode sheet ukwenza (inkqubo yokwambathisa okuqhubekayo). Imisebenzi ephambili ibandakanya ukukhulula ngokuzenzekelayo, ukulungiswa, ukusika, ubungakanani beCCD kunye nokufumanisa isiphene, ukususwa kothuli, ukusika, ukufumanisa ububanzi beCCD, ukujika ngokuzenzekelayo kunye nokunye.

Qhagamshelana nathi

iinkcukacha zemveliso

Ingcaciso yeMveliso

I-Laser die cut and slitting machine edibeneyo sisixhobo esiphezulu esidibanisa iteknoloji ye-laser kunye nenkqubo yomatshini echanekileyo, isetyenziselwa ukusika kunye nezinto zokuqhawula ngokuchaneka okuphezulu.

Iimpawu zayo eziphambili kunye neenzuzo:

1. Ukusika okuphezulu: izixhobo zamkela iteknoloji ye-laser yokusika ngokuchaneka okuphezulu kakhulu. Ububanzi be-laser beam buncinci kakhulu, obunokuthi bugxininise ngokuchanekileyo kwizinto ezijoliswe kuyo, ukuqonda ukuchaneka kwe-micron-level cut.

2. I-Slitting High-efficiency slitting: Ukongeza kumsebenzi wokusika, izixhobo zinokwenza umsebenzi ophezulu wokuqhawula. Ngokusebenzisa inkqubo echanekileyo yomatshini kunye nenkqubo yokulawula, izinto eziphathekayo zinqunyulwa ngokukhawuleza kububanzi obuchaziweyo kunye nesantya sokuqhawula ngokukhawuleza.

3. Iqondo eliphezulu lokuzenzekelayo: izixhobo zamkela inkqubo yokulawula ngokuzenzekelayo, enokuqonda imisebenzi yokutya ngokuzenzekelayo, ukubeka ngokuzenzekelayo, ukusika ngokuzenzekelayo kunye ne-slitting. Oku kuphucula kakhulu ukusebenza kakuhle kwemveliso kwaye kunciphisa ubunzima kunye nempazamo yokusebenza ngesandla.

4. Uluhlu olubanzi lwesicelo: izixhobo zifanelekile ukusika kunye nokuqhawula izinto ezahlukeneyo, ezifana nephepha, iiplastiki, iifilimu zetsimbi kunye nokunye. Izinto ezahlukeneyo ziyakwazi ukulungiswa ngokulungelelanisa iiparamitha ze-laser kunye nenkqubo yomatshini.

5. Ukukhuselwa kwendalo kunye nokugcinwa kwamandla: izixhobo zamkela iteknoloji yelaser, enokusetyenziswa kwamandla aphantsi kwaye ivelise inkunkuma encinci xa kuthelekiswa nokusika oomatshini bendabuko. Okwangoku, inkqubo yokusika i-laser ivelisa ubushushu obuncinci kwaye inefuthe elincinci le-thermal kwizinto eziphathekayo.

Imveliso dispaly

Isishwankathelo seZixhobo

I-Laser die ukusika kunye nomatshini wokusika42qy

Iimpawu ezisebenzayo

Ukusebenza kwe-laser ye-high-speed speed 60m / min-200m / min, ukuchaneka kwesithuba sendlebe ≤± 0.2mm;

Inkqubo yokususa uthuli kunye nenkqubo yokubeka iliso kwindawo nganye, ukufezekisa uthuli ngaphakathi kwesixhobo ukufikelela kwimigangatho ye-10,000;

Ukulawulwa kokuguqulwa kwe-Laser frequency, ukuphepha ukusika ngokugqithiseleyo okanye ukusika okuqhubekayo, ukulawula ngokufanelekileyo i-burr kunye nobushushu obuchaphazelekayo be-bead ubukhulu bendawo, ukuyila okudibeneyo, isayithi kunye neendleko zabasebenzi ezincitshiswe ngamaxesha angama-3 ~ 5.